Automated Adhesive Dispense SYSTEMS
Automated Dispense Systems for flat and 3D panel laminations, bonding SIPs, composite panels – X-Y Axis gluing lines and full robotic applications.
Design, build & integration.
Latest PLC/IT Architecture, Industry 4.0.
Smart valves, with self-diagnostic monitoring.
High speed, maximum throughput systems.
High resolution photelectric sensors for precision adhesive placement.
Advanced vision systems, for precision alignment and automatic rejection of faulty parts.
Machine safety, CE Marking.
Bonding consistency, quality products.
Single and 2-component systems.
Addressable, connectivity.
Smart touch screen HMI, process visualisation.
Use of KISS Design Principles – reliability, ease of use and lowest cost of ownership.
Cost efficiency analysis – we have a fully functional demo line available for evaluation trials.
